Soft contact function
90 degree rotator
Option: 3 binning
Wide DUT pitch
Applicable package | QFP, BGA, CSP, WLCSP etc. |
---|---|
Package dimensions | QFP: 4x4 ~ 28x28 mm BGA: 4x4 ~ 35x35 mm |
Socket type | C/S |
Temperature range | Ambient, +50 to 130deg.C +/-3deg.C |
Output bin | 2 BIN (Option: 3 BIN) |
Index time | Indirect: 1.0 sec |
Throughput | H242MB: 2000 UPH (Hot) H282MB: 1800 UPH (Hot) |
Test site | 4ch/8ch |
Contact pitch | X: 240 Y: 160 mm (4-site) X: 240 Y: 80 mm (8-site) |
Contact pressure | 60 Kg/DUT(4-site) 30 Kg/DUT(8-site) |
Power supply | AC200V(+-10%), 40A |
Air supply | 0.4 MPa, 270 L/min |
Equipment dimensions | W1500 x D1500 x H1700 mm |
Weight | 1150 kg |