Soft contact function
90 degree rotator
Option: 3 binning
Wide DUT pitch

Standard Specification

Applicable package QFP, BGA, CSP, WLCSP etc.
Package dimensions QFP: 4x4 ~ 28x28 mm
BGA: 4x4 ~ 35x35 mm
Socket type C/S
Temperature range Ambient, +50 to 130deg.C   +/-3deg.C
Output bin 2 BIN
(Option: 3 BIN)
Index time Indirect: 1.0 sec
Throughput H242MB: 2000 UPH (Hot)
H282MB: 1800 UPH (Hot)
Test site 4ch/8ch
Contact pitch X: 240   Y: 160 mm (4-site)
X: 240   Y: 80 mm (8-site)
Contact pressure 60 Kg/DUT(4-site)
30 Kg/DUT(8-site)
Power supply AC200V(+-10%), 40A 
Air supply 0.4 MPa, 270 L/min
Equipment dimensions W1500 x D1500 x H1700 mm
Weight 1150 kg

Please feel free to contact us for details.

Inquiry about semiconductor


SC Division

For TEL: +81-96-294-1700