Lead Forming Machine

・ Forming Leads by several process as tip bending,

   temporary bending and final bending.

・ Forming method is selectable among Mold, Motor and Cylinder.

・ Inspect and detect foreign substances and chip cracks on

   IC devices top/reverse side by image processing.

・ Loading IC devices by Parts feeder, Tape, Stick and Tray.

・ Unloading IC devices to Tape, Stick, Tray and Littering box.

Appearancee Inspection Machine;

 Tray to Tray（Stick to Stick - Capable）

  Inspecting Image Processing Unit

Automatically shaping from wire to hook and assembling.

Capable of cooling down to -80 deg.C temperature.

Enable to customize combination the other robots and transfer system for image processing 

Handling Laser Marking system and Pogo-pin insertion system.

Capable to manufacture machines according to customers' needs.