Shaping the Future with Generative AI and Power Semiconductors
The group companies engaged in semiconductor and mechatronics related business field leverage their expertise in semiconductor manufacturing technologies and integrate diverse technical specializations to drive innovation across various fields.
Through these efforts, they contribute to the advancement of next-generation industries and aim for sustainable growth.
Comprising four companies, this business group serves as a center of excellence in mechatronics technologies and drives innovation at the forefront of the industry.
By integrating each company's specialized expertise to develop advanced solutions, we meet diverse market needs and accelerate the progress of next-generation industrial development.
Through three business divisions, we provide innovative technology.
Our product lineup includes the world's leading hard disk burnisher, semiconductor test handlers, visual inspection systems, automation equipment for various industries, texturing systems for high-efficiency solar cell wafers, precision cleaning systems, and drying systems.
By delivering these advanced solutions, we drive innovation across diverse fields.
With four overseas subsidiaries, we manufacture LED, semiconductor classifiers, taping machines, and LED measurement devices utilizing high-speed handling technology. Additionally, we specialize in producing ultra-small and ultra-thin embossed carrier tapes.
Y.A.C. Beam manufactures laser annealers for power semiconductors and laser drillers for ultra-fine hole processing, utilizing advanced laser technology.
Additionally, the company produces ion beam milling systems for precision surface treatment and ion beam sputtering equipment, applying advanced ion beam technology.
YAC DAStech manufactures slicers and core drilling machines capable of high precision cutting for a wide range of materials, including sapphire, glass, ceramics, metals, and magnets.
Additionally, the company meets industry demands through the sale of used semiconductor equipment.
Leveraging extensive experience and advanced technical expertise, we provide high-precision equipment utilizing laser and ion beam technologies.
Our solutions enable exceptionally reliable thermal processing (laser annealing) and microfabrication (ion beam milling, laser drilling), widely adopted in semiconductor device and electronic component manufacturing processes, from research and development to mass production.
Guided by the philosophy of “KIWAMERU” (mastering, perfecting, and refining), we pursue innovation and advancement in cutting technology. Widely utilized in precision processing fields including electronic component manufacturing, our innovative technology serves as a key competitive advantage. Differentiation in the industry is driven by optimal blade selection, high machine rigidity, precise automatic alignment and setup, and superior operability.
Providing a diverse range of equipment essential for hard disk manufacturing, including precision polishing, low-dust conveyors, various automated transport systems, high and low temperature chip handlers, wafer transfer systems, and visual inspection devices. Specializing in customized equipment manufacturing tailored to customer needs, we drive technological innovation at the forefront of the industry.
We manufacture high-performance equipment that meets industry demands by utilizing ultra-fine processing technology (2μm–10μm) based on chemical solution applications, essential for producing high-efficiency solar cell wafers, as well as advanced drying technology for semiconductor cleaning.
In semiconductor and LED device inspection taping systems, sheets and parts feeders are used for supply, enabling image inspection and electrical property measurement. Furthermore, in the LED sector, we also manufacture inspection and measurement equipment, providing high-precision testing solutions. Our carrier tapes, specializing in ultra-small and ultra-thin formats (0.2mm or less), are supplied to customers worldwide.
