Low cost
Compact
High contact pressure
Retest mode
| Applicable package | QFP, TSOP, BGA etc. |
|---|---|
| Package dimensions | 6x6 - 46x46 mm |
| Socket type | Clam-shell, Pogo-pin |
| Temperature range | Ambient, +50 to 135deg.C +/-3deg.C |
| Output bin | 2 BIN |
| Index time | Indirect: 0.9 sec |
| Throughput | 1800 UPH |
| Test site | 2ch |
| Contact pitch | Y-line: 60 mm |
| Contact pressure | 30 kg/DUT |
| Power supply | AC200V, Less than 30A (Single phase) |
| Air supply | 0.4 MPa |
| Equipment dimensions | W1100 x D1350 x H1650 mm |
| Weight | 800 kg |
