Low cost
Compact
Retest mode
Applicable package | QFP, TSOP, BGA etc. |
---|---|
Package dimensions | 6x6 - 28x28 mm |
Socket type | Open-top |
Temperature range | A282D: Ambient H282D: +50 to 125deg.C +/-3deg.C |
Output bin | 2 BIN |
Index time | Open-top: 1.2 sec |
Throughput | 4000 - 4800 UPH |
Test site | 8ch |
Contact pitch | X: 40 Y: 60 mm |
Contact pressure | - |
Power supply | AC200V, Less than 30A (Single phase) (H282D) |
Air supply | 0.4 MPa |
Equipment dimensions | W1100 x D1350 x H1650 mm |
Weight | 800 kg |