<Product introduction>
- Batch(200wfs/h) type Tool by an automatic transfer cassette
- The texture on the surface of the wafer processing
- Tool configuration will be determined according to the type of wafer
1.Single crystal Wafer Texture
Pre Clean > Alkali Texture
2.Polycrystal Wafer Texture
Pre Clean > Acidi Texture
| Single crystal Texture Standard specification | |
|---|---|
| Dimension | 18000(W) x 2100(D) x 2600(H) |
| Throughput | 2000wfs/h |
| Bath Configlation | LD |
| Pre Clean (SC1) | |
| Rinse-1 | |
| TEXTURE-1 (Alkali) | |
| TEXTURE-2 (Alkali) | |
| TEXTURE-3 (Alkali) | |
| TEXTURE-4 (Alkali) | |
| TEXTURE-5 (Alkali) | |
| TEXTURE-6 (Alkali) | |
| Rinse-2 | |
| Rinse-3 | |
| Rinse-4 | |
| Final Clean (HF/Hcl) | |
| Rinse-5 | |
| Pre Dry (HOT DIW) | |
| Dry (HOT Blow) | |
| ULD | |
| Option | Chemical Supply System, FA etc |
| Safety Specification | Possible to the corresponding CE-Mark and UL standards |
| Polycrystal TextureStandard specification | |
|---|---|
| Dimension | 16000(W) x 2100(D) x 2600(H) |
| Throughput | 2000wfs/h |
| Bath Configlation | LD |
| Pre Clean (SC1) | |
| Rinse-1 | |
| TEXTURE-1 (Acidi) | |
| Rinse-2 | |
| Rinse-3 | |
| Stain Remove | |
| Rinse-4 | |
| Metal Remove | |
| Rinse-5 | |
| Final Clean (SC1l) | |
| Rinse-6 | |
| Pre Dry (HOT DIW) | |
| Dry (HOT Blow) | |
| ULD | |
| Option | Chemical Supply System, FA etc |
| Safety Specification | Possible to the corresponding CE-Mark and UL standards |
Please feel free to contact us for details
Inquiry about photo volataics
WP Division
For TEL: +81-97-588-1333
