High speed
Low dust
Low vibration
| Applicable package | QFP, QFN, SOP, SSOP, BGA |
|---|---|
| Package dimensions | 3x3 to 38x38 mm |
| Socket type | Clam-shell, Pogo-pin |
| Temperature range | Ambient, +50 to 150deg.C +/-3deg.C |
| Output bin | 3 BIN |
| Index time | > 0.55 sec |
| Throughput | Ambient: 7000 UPH Hot: 5500 UPH |
| Test site | 4ch |
| Contact pitch | X: 60 Y: 80 mm |
| Contact pressure | 348 N/DUT (35.5 kg/DUT) |
| Power supply | AC200V, 30A (Single phase) |
| Air supply | 0.4 MPa, 200 L/min |
| Equipment dimensions | W1500 x D1500 x H1850 mm |
| Weight | 900 kg |
