High speed
Low dust
Low vibration

Standard Specification

Applicable package QFP, QFN, SOP, SSOP, BGA
Package dimensions 3x3 to 38x38 mm
Socket type Clam-shell, Pogo-pin
Temperature range Ambient, +50 to 150deg.C   +/-3deg.C
Output bin 3 BIN
Index time > 0.55 sec
Throughput Ambient: 7000 UPH
Hot: 5500 UPH
Test site 4ch
Contact pitch X: 60   Y: 80 mm
Contact pressure 348 N/DUT (35.5 kg/DUT)
Power supply AC200V, 30A (Single phase)
Air supply 0.4 MPa, 200 L/min
Equipment dimensions W1500 x D1500 x H1850 mm
Weight 900 kg

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For TEL: +81-96-294-1700