Y.A.C. Mechatronics Co., Ltd. will transition from its current three-division structure to a five-division structure beginning in the second half of fiscal year 2026.

The two newly added divisions are the DS Division and the CS Division. The DS Division specializes in semiconductor-related equipment, including scribers and reticle polishing machines. The CS Division manufactures cleaning-related equipment as well as packaging machines for e-commerce logistics applications.

Together with the existing three divisions, namely the MD Division (HDD-related burnishing equipment and related products), the SC Division (semiconductor-related handler equipment and related products), and the WP Division (various cleaning and drying systems and related products), we will pursue business expansion through a five-division structure that promotes both collaboration and healthy competition. Through these efforts, we will continue to develop and provide innovative products and equipment across a wide range of industries and applications.

Y.A.C. Mechatronics Co., Ltd. will continue to uphold the YAC Group’s corporate mission of "Contributing More to Society." By rapidly anticipating future changes and responding to diverse market needs, we will strive to further enhance our corporate value. United as five divisions working as one team, we are committed to continued growth and advancement.

 

 

Y.A.C. MECHATRONICS CO.,LTD
Representative Director & President
Hideaki Kobayashi