<Product introduction>

 

• Batch type automatic conveying equipment with cutting board and basket

• It is a Tool that performs a "detachment from the cutting board" "wash" to the ingot after slicing process

• Tool configuration will be set according to the type of slicing process
  
  1. Slurry Clean Process
  2. Post Wire Saw Clean Process

 

• Automatically performs cleaning, peeling, collecting and drying
• Total system including wafer basket for collecing can be delivered

Post Wire Saw Cleaning Tool Standard Spec
Dimension	6000(W)x 2200(D) x 3000(H)
Throughput	2400wfs/h
Bath Configlation	LD
	Spray-1
	Spray-2
	Rinse-1 (US)
	Rinse-2 (US)
	Remove-1
	Remove-2
	Final Rinse (US)
	ULD
Option	Wafer Recovery Basket Underwater LD, Underwater ULD
Safety Specification	Possible to the corresponding CE-Mark and UL standards