The dry etching system using plasma technology is the most suitable plasma etching machine for highly precise processing of LTPS or OLED for smartphones, as well as the efficiencient manufacturing process, mask-saving technology, and enlargement.

Standard Specification

Model : GAEA Series

Chamber Type Multi Chamber
Process Module Max. 5Chambers
Glass Size ≦ 2200 x 2500(G8.5 size)
Plasma Mode ICP
RF Genarator TOP 13.56MHz, MAX 60KW
Bias 4MHz, MAX 60KW
ESC Monopore type ESC
Cooling System He GAS Press. CONT.(He Colling)

Model : DES-MS Series

Chamber Type Multi Chamber
Process Module Max. 3Chambers
Glass Size ≦ 2200×2500(G8.5 size)
Plasma Mode Cathode(RIE)Type
+Double System(O.P.)
RF Genarator 13.56MHz(or4MHz),MAX 20KW

Please feel free to contact us for details.

Inquiry about our products.

Sales Dept.

Call: +81-42-546-2870