Dry etching system for FPD production, using new developed plasma technology.
It is the most suitable equipment for efficiency of manufacturing process and increased productivity for highly precise processing of LTPS or OLED, TAOS, smartphones, TV, and monitor etc.
Also, this equipment is compatible for special use etching process, other than FPD.
| Chamber Type | Multi Chamber |
|---|---|
| Process Module | Max. 5Chambers |
| Glass Size |
Minimum: 300mm × 400mm Maximum: 2200mm × 2500mm |
| Plasma Mode |
ICP (Inductive Coupled Plasma) RIE (Reactive Ion Etching) |
| Substrate fixing | ESC (Electro-Static Chuck) |
| Cooling System | He gas pressure control |
| Use |
FPD, Optical device, MEMS, NIL, PCB, FOPLP, Photomask etc, Microfabrication for silicon based, and metal based thin layer Resist and organic layer ashing Discum, Desmia, Surface modification, Plasma cleaning Batch processing for small size substrate etc. |
Please feel free to contact us for details.
Inquiry about our products.
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