Dry Etching equipment for R&D, and trial production line.

 

Suitable for microfabrication process of FPD, optical parts, nanoimprint, printed circuit board, interposer, photomask, MEMS, FOPLP, and other material.

 

Corresponding wafer size in standard spec is 300mm x 300mm, but we are able to provide suitable equipment design for each customer's using work size.

Substrate size	300mm × 300mm (Standard spec)
Discharging method	ICP mode RIE mode ICP＋Bias mode select
Use	Silicon based thin layer and other metal based thin layer   Microfabrication for compound semiconductor   Resist and organic layer ashing   Discum, Desmia, Surface modification, Plasma cleaning
Other function	Substrate cooling system (ESC chuck for glass substrate)   Etching end point detection   Multi step, automatic operation   Space saving design