Capability of tri-temp testing
Low cost, Short lead time
Option: Customized tester frame
Best for development

Standard Specification

Applicable package QFP, BGA, QFN, SSOP etc.
Package dimensions 5x5 to 31x31 mm
Socket type Clam-shell
(Option: Open-top)
Temperature range Hot: +50 to 150deg.C +/-3deg.C
Cold: 0 to -50deg.C +/-3deg.C
Output bin 2 BIN
Index time 3.0 sec
Throughput Ambient: 450 UPH
Test site 1ch
Contact pitch Center 1ch
Contact pressure 30 kg
Power supply AC200V, 30A
Air supply 0.4 MPa, 200 L/min (Cold)
Equipment dimensions W760 x D1140 x H700 mm
Weight 150 kg
ISO9001
拡大
ISO9001

Please feel free to contact us for details.

Inquiry about semiconductor

 

SC Division

For TEL: +81-96-294-1700