• Processing -precise hole such as 15 to 50 μｍ

• Processing maximum one million units of holes with maximum 100ｍｍ scale by 30 to 500 seconds.

• Positioning accuracy<±0.5μm, Diameter accuracy<±0.5μm

• No influence from changing of laser profile.
• Easy control by simple optical system.

Possible for resin processing without heat defect by UV laser.

In case of CO_{2} laser, 50μm diameter is limit because of big limit condensing diameter by long wavelength, and melting and burnt by heat treatment.

UV laser cut directly C-C joint by high photon energy.

• Possible for processing multi holes collectively by large output excimer laser and multiple array of micro lens.
• Processing maximum one million units of holes with maximum 100ｍｍ scale by 30 to 500 seconds by beam scanning on the micro lens.

• Accuracy of hole positioning <±0.5μｍ, by high precise micro lens array.
• Accuracy of hole dimension<±0.5μｍ, by beam vibration system.
• Equalization of beam profile without optical system and possible for high precise processing.

• Easier control than old technologies by simple optical system.
• Possible for long term stable processing without influence of excimer laser beam quality changes by beam vibration system.