YAC Homepage Company Profile Company Guidance Borad Members Company History Back to YAC Homepage Financal, IR Back to YAC Homepage Business Guidance Memory Disk Business Product Line Process Equipment Semiconductor Equipment Semiconductor Business Product Line 200 Series Handler 500 Series Handler 900 Series Handler ISO 9001 Plasma System Business Product Line FPD Equipment With Plasma Semiconductor Process Equipment Other FPD Equipment Cleaning System Business Product Line Field Emission Lump Business ND Emitter Photovoltaics Business Inline Process Equipment Inline Process Equipment Batch Process Equipment Back to YAC Homepage Employment Back to YAC Homepage ECO, Society Back to YAC Homepage Network Japan Domestic Network Back to YAC Homepage

500 Series Basic Specifications
Package	3x3 - 32x32mm	* Option: Larger than 32x32mm
Tray	JEDEC only	* Option: Other than JEDEC
Socket	5mm smaller than 　 Cotnact Pitch	* e.g.) Smaller than 35mm 　for 40x40mm Contact Pitch
Index Time	0.47 sec.	* It may vary up to Package 　and Test time.
Throughput	6000 - 7000 UPH	* It may vary up to Package.
Contact Pitch	400x60, 40x40mm	* Option: Various DUT Pitch
Contact Pressure	15 Kg/Socket	* Option: To be changed 　 for requirement.
Power Supply	AC200V, 30A	* Approx. 10A for Ambient 　 use only.
Air Supply	0.4MPa, 300L/min.	* Approx. 100L/min. 　 for Ambient use only.
Outside Dimension	W 1500 x D 1550 mm	* It may vary up to Output bins.
Weight	900 Kg	-